A terminal pair including a first terminal provided with a first contact portion and a second terminal provided with a second contact portion. The first contact portion includes a composite covering layer having a Sn—Pd based alloy phase and a Sn phase, and has a surface including the Sn—Pd based alloy phase and the Sn phase. The second contact portion includes a Cu—Sn alloy layer and a Sn layer covering part of the Cu—Sn alloy layer, and has a surface including a Cu—Sn alloy region corresponding to an exposed portion of the Cu—Sn alloy layer and a Sn region corresponding to an exposed portion of the Sn layer. A coefficient of friction for sliding movement between the first contact portion and the second contact portion is lower than a coefficient of friction for sliding movement between the two first contact portions and between the two second contact portions.