Invention Grant
- Patent Title: Connector and connector assembly
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Application No.: US15647582Application Date: 2017-07-12
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Publication No.: US10177477B2Publication Date: 2019-01-08
- Inventor: Xiaozhi Fu , Ming Shi , Xiang Xu , Wei Zhang , Cui Li
- Applicant: Tyco Electronics (Shanghai) Co. Ltd.
- Applicant Address: CN Shanghai
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.
- Current Assignee Address: CN Shanghai
- Agent Barley Snyder
- Priority: CN201620728627U 20160712
- Main IPC: H01R9/05
- IPC: H01R9/05 ; H01R12/73 ; H01R12/70 ; H01R12/91 ; H01R13/58 ; H01R12/57 ; H01R13/11 ; H01R4/48
Abstract:
A connector assembly comprises a first connector and a second connector. The first connector consists of a first monolithically formed conductive terminal adapted to be soldered onto a first circuit board. The second connector consists of a second monolithically formed conductive terminal adapted to be soldered onto a second circuit board. The first connector mates with the second connector to electrically connect the first circuit board to the second circuit board.
Public/Granted literature
- US20180019530A1 Connector and Connector Assembly Public/Granted day:2018-01-18
Information query
