Invention Grant
- Patent Title: Mounting substrate
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Application No.: US15481987Application Date: 2017-04-07
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Publication No.: US10177289B2Publication Date: 2019-01-08
- Inventor: Yuki Fukui , Junko Izumitani , Tadayuki Okawa
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2014-215474 20141022
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L33/60 ; H01L33/62 ; H01L23/538 ; H01L25/16 ; H02H9/04 ; H01L29/866

Abstract:
A mounting substrate that includes external connection electrodes on a rear surface of a base material, and mounting electrodes on a front surface of the base material. In-hole electrodes connect the external connection electrodes and the mounting electrodes. A reflective film containing Al is located between the base material and the mounting electrodes. The reflective film is covered with an insulating film layer.
Public/Granted literature
- US20170213943A1 MOUNTING SUBSTRATE Public/Granted day:2017-07-27
Information query
IPC分类: