Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15706263Application Date: 2017-09-15
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Publication No.: US10177248B2Publication Date: 2019-01-08
- Inventor: Matteo Dainese , Erich Griebl
- Applicant: Infineon Technologies Austria AG
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102016117511 20160916
- Main IPC: H01L29/74
- IPC: H01L29/74 ; H01L31/111 ; H01L29/739 ; H01L21/027 ; H01L21/265 ; H01L21/266 ; H01L21/308 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/36 ; H01L29/417 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes a semiconductor body including a base region and two semiconductor mesas separated from each other by an insulated trench gate structure extending from a first side into the base region, and including a dielectric layer separating a gate electrode from the semiconductor body. Each semiconductor mesa includes, in a cross-section perpendicular to the first side, a body region forming a pn-junction with the base region, a latch-up-safety region of the same conductivity type as the body region arranged between the body region and the first side, and having a higher doping concentration than the body region, and an emitter region between the dielectric layer and the latch-up-safety region and forming a pn-junction with the body region. At least one semiconductor mesa includes an emitter contact arranged between the emitter region and the latch-up-safety region and forming with the latch-up-safety and emitter regions an Ohmic contact.
Public/Granted literature
- US20180083132A1 Semiconductor Device Public/Granted day:2018-03-22
Information query
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