Invention Grant
- Patent Title: Phase changing on-chip thermal heat sink
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Application No.: US15439099Application Date: 2017-02-22
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Publication No.: US10177071B2Publication Date: 2019-01-08
- Inventor: Mattias E. Dahlstrom
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Steven J. Meyers; Andrew M. Calderon
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L21/762 ; H01L21/02 ; H01L23/367 ; H01L21/48 ; H01L21/768 ; H01L23/373 ; H01L49/02 ; H01L23/00 ; H01L23/528 ; H01L23/532 ; H01L23/36 ; H01L23/522
Abstract:
A method of forming an on-chip heat sink includes forming a device on a substrate. The method also includes forming a plurality of insulator layers over the device. The method further includes forming a heat sink in at least one of the plurality of insulator layers and proximate to the device. The heat sink includes a reservoir of phase change material having a melting point temperature that is less than an upper limit of a design operating temperature of the chip.
Public/Granted literature
- US20170162471A1 PHASE CHANGING ON-CHIP THERMAL HEAT SINK Public/Granted day:2017-06-08
Information query
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