Invention Grant
- Patent Title: Heat conductive insulating sheet, power module, and manufacturing method thereof
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Application No.: US14770532Application Date: 2014-03-11
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Publication No.: US10177068B2Publication Date: 2019-01-08
- Inventor: Kenji Mimura , Yurie Nakamura , Xiaohong Yin , Kazuhiro Tada
- Applicant: MITSUBISHI ELECTRIC CORPORATION
- Applicant Address: JP Chiyoda-ku
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Chiyoda-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2013-052670 20130315
- International Application: PCT/JP2014/056338 WO 20140311
- International Announcement: WO2014/142123 WO 20140918
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/433 ; H01L23/495 ; H01L23/29 ; H01L23/00 ; B29C45/00 ; B29C45/02 ; B29C45/14 ; B29C35/02 ; H01L23/31 ; B29K63/00 ; B29K105/16 ; B29K509/04 ; B29L31/34
Abstract:
A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.
Public/Granted literature
- US20160013116A1 HEAT CONDUCTIVE INSULATING SHEET, POWER MODULE, AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-01-14
Information query
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