Invention Grant
- Patent Title: Low-cost nano-heat pipe
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Application No.: US14673584Application Date: 2015-03-30
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Publication No.: US10175005B2Publication Date: 2019-01-08
- Inventor: John W. Osenbach , Jie Tang , S. Eugene Messenger , John Coronati
- Applicant: Infinera Corporation
- Applicant Address: US CA Sunnyvale
- Assignee: Infinera Corporation
- Current Assignee: Infinera Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Harrity & Harrity LLP
- Agent David L. Soltz
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28D15/02 ; B23P15/26 ; F28D15/04 ; H01L23/427 ; H01L21/48

Abstract:
A method of fabricating a heat pipe may include providing a first material as a body section. The method may include stamping or etching the body section to include the cavity. A portion of the body section may constitute a wall of the cavity. The method may include stamping or etching the wall of the cavity to provide a set of corrugations on a portion of the wall of the cavity. The method may include forming an opening in the wall of the cavity. The method may include attaching a lid over the cavity. The lid constituting at least a portion of a hermetic seal of the cavity. The method may include attaching a cover to the body section approximately adjacent to the opening in the cavity. The method may include attaching a valve to the body section approximately at the opening to the cavity.
Public/Granted literature
- US20160290734A1 LOW-COST NANO-HEAT PIPE Public/Granted day:2016-10-06
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