A multiplicity of sleeve subassemblies each include an electrically insulative portion, and are configured to support an electrical contact having a socket. Each insulative portion has a socket bore and at least one radial aperture extending radially outward therefrom. The sleeve subassemblies are transported across a plating bath whereby at least a lower segment of the insulative portions become submerged in plating solution. The socket bore maskingly engages the contact, thereby substantially preventing plating solution from contacting the outer surface of the socket. The radial apertures facilitate the continuous flow of plating solution through each socket so as to enable selective plating of the socket inner surface. The sleeve subassemblies may be formed from mutually-engageable half-sleeves conveyed on separate closed-loop transport belts so as to facilitate efficient loading, plating and release of the electrical contacts. The radial apertures may take on various forms, including holes, circumferential slits or vertical slits.