Invention Grant
- Patent Title: Housing with electronic components
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Application No.: US15830714Application Date: 2017-12-04
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Publication No.: US10172247B2Publication Date: 2019-01-01
- Inventor: Mario Lenz , Stephan Werker , Eric Rooks
- Applicant: Hanon Systems
- Applicant Address: KR Daejeon
- Assignee: HANON SYSTEMS
- Current Assignee: HANON SYSTEMS
- Current Assignee Address: KR Daejeon
- Agency: Shumaker, Loop & Kendrick, LLP
- Agent James D. Miller
- Priority: DE102016224118 20161205
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K5/02 ; H05K7/14

Abstract:
An enclosure for electronic components with a base and a capping forming a room for receiving at least one circuit board at least one circuit board support positioned on the base for the support of the at least one circuit board. At least one fastening element attaches the at least one circuit board to the circuit board support through an engagement with the circuit board support, wherein the capping is formed and/or attached to the base in such a manner that room is formed between the fastening element and the capping in such a manner that a detachment of the fastening element from the circuit board support is prevented.
Public/Granted literature
- US20180160556A1 HOUSING WITH ELECTRONIC COMPONENTS Public/Granted day:2018-06-07
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