Invention Grant
- Patent Title: Semiconductor package structures and method of manufacturing the same
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Application No.: US14941069Application Date: 2015-11-13
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Publication No.: US10170658B2Publication Date: 2019-01-01
- Inventor: Yu-Hsuan Tsai , Lu-Ming Lai
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L31/173
- IPC: H01L31/173 ; H01L25/16

Abstract:
An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. The light emitter includes an emitting area facing the substrate. The light detector includes a receiving area facing the substrate. The light emitter emits light within a range of wavelengths, and the substrate passes the light emitted by the light emitter. The opaque material is disposed on the substrate, and absorbs or attenuates the light within the range of wavelengths.
Public/Granted literature
- US20170141257A1 SEMICONDUCTOR PACKAGE STRUCTURES AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-05-18
Information query
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