Invention Grant
- Patent Title: High voltage laterally diffused MOSFET with buried field shield and method to fabricate same
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Application No.: US15792923Application Date: 2017-10-25
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Publication No.: US10170567B2Publication Date: 2019-01-01
- Inventor: Tak H. Ning
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Harrington & Smith
- Agent Louis Percello
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L21/336 ; G06F17/50 ; H01L27/088 ; H01L29/739 ; H01L29/40 ; H01L29/10 ; H01L21/265

Abstract:
A structure includes a laterally diffused (LD) MOSFET with an n-type drift region disposed on a surface of a substrate and a p-type body region contained in the drift region. The structure further includes an n-type source region contained in the p-type body region; an n-type drain region contained in the n-type drift region; a gate electrode disposed on a gate dielectric overlying a portion of the p-type body region and the n-type drift region and an electrically conductive field shield member disposed within the n-type drift region at least partially beneath the p-type body region and generally parallel to the gate electrode. The electrically conductive buried field shield member is contained within and surrounded by a layer of buried field shield oxide and is common to both a first LD MOSFET and a second LD MOSFET that are connected in parallel. Methods to fabricate the structure are also disclosed.
Public/Granted literature
- US20180047816A1 High Voltage Laterally Diffused MOSFET with Buried Field Shield and Method to Fabricate Same Public/Granted day:2018-02-15
Information query
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