Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15856070Application Date: 2017-12-28
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Publication No.: US10170542B2Publication Date: 2019-01-01
- Inventor: Wen-Ying Wen
- Applicant: Nuvoton Technology Corporation
- Applicant Address: TW Hsinchu
- Assignee: Nuvoton Technology Corporation
- Current Assignee: Nuvoton Technology Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW105143811A 20161229
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/10 ; H01L29/78

Abstract:
A semiconductor device including a substrate of a first conductivity type, a metal-oxide-semiconductor-field-effect transistor (MOSFET), junction gate field-effect transistors (JFETs), an isolation structure, and a buried layer of a second conductivity type is provided. The MOSFET is located on the substrate and has a first epitaxial layer of the second conductivity type. The JFET is located on the substrate and has a second epitaxial layer of the second conductivity type. The isolation structure is located between the MOSFET and the JFET to separate the first epitaxial layer from the second epitaxial layer. The buried layer is located between the MOSFET and the substrate. The buried layer extends from below the MOSFET to below the isolation structure and below the JFET, so as to electrically connect the MOSFET to the first JFET.
Public/Granted literature
- US20180190765A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-07-05
Information query
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