Invention Grant
- Patent Title: Bulk fin formation with vertical fin sidewall profile
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Application No.: US15292187Application Date: 2016-10-13
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Publication No.: US10170471B2Publication Date: 2019-01-01
- Inventor: Kangguo Cheng , Hong He , Sivananda K. Kanakasabapathy , Chiahsun Tseng , Yunpeng Yin
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Edward J. Wixted, III
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/088 ; H01L21/84 ; H01L21/762 ; H01L21/311 ; H01L29/66 ; H01L21/308 ; H01L21/3065 ; H01L21/02 ; H01L21/8234 ; H01L29/165

Abstract:
A semiconductor device, having a heterogeneous silicon stack, wherein the heterogeneous silicon stack comprises at least a base layer, a doped silicon layer, and an undoped silicon layer. The semiconductor device further includes a plurality of silicon fins atop a doped silicon oxide fin layer and an undoped silicon oxide fin layer, wherein the plurality of silicon fins have a uniform width along the height of the plurality of silicon fins, and wherein the plurality of silicon fins have a plurality of hard mask caps.
Public/Granted literature
- US20170033103A1 BULK FIN FORMATION WITH VERTICAL FIN SIDEWALL PROFILE Public/Granted day:2017-02-02
Information query
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