A method for electrically coupling a pad and a front face of a pillar, including shaping the front face pillar, the front face having at least partially a convex surface, applying a suspension to the front face or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles and electrically conducting nanoparticles, arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad, evaporating the carrier fluid thereby confining the microparticles and the nanoparticles, and thereby arranging the nanoparticles and the microparticles as percolation paths between the front face of the pillar and the pad, and sintering the arranged nanoparticles for forming metallic bonds at least between the nanoparticles and/or between the nanoparticles and the front face of the pillar or the pad.