- Patent Title: Electronic component package and method of manufacturing the same
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Application No.: US15667738Application Date: 2017-08-03
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Publication No.: US10170386B2Publication Date: 2019-01-01
- Inventor: Seung On Kang , Woo Sung Han , Young Gwan Ko , Chul Kyu Kim , Han Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2015-0065507 20150511; KR10-2015-0131398 20150917
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/31 ; H01L23/16 ; H01L23/552 ; H01L23/00 ; H01L23/36 ; H01L23/498 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/522 ; H01L23/29 ; H01L23/367
Abstract:
An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.
Public/Granted literature
- US20170330814A1 ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2017-11-16
Information query
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