Invention Grant
- Patent Title: Chip resistor and chip resistor assembly
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Application No.: US15634305Application Date: 2017-06-27
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Publication No.: US10170223B2Publication Date: 2019-01-01
- Inventor: Woo Jin Choi
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2016-0152018 20161115
- Main IPC: H01C7/00
- IPC: H01C7/00 ; H01C1/142 ; H05K1/18 ; H01C17/00 ; H01C17/245 ; H01C17/28

Abstract:
A chip resistor includes a base substrate having first and second surfaces opposing each other. First and second resistor layers are separated from each other and are on the first surface of the base substrate. First and second terminals are on opposing end portions of the base substrate, respectively, and are connected to first sides of the first and second resistor layers, respectively. Third and fourth terminals are between the first and second terminals, and are respectively connected to second sides of the first and second resistor layers that respectively oppose the first sides of the first and second resistor layers.
Public/Granted literature
- US20180137957A1 CHIP RESISTOR AND CHIP RESISTOR ASSEMBLY Public/Granted day:2018-05-17
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