- Patent Title: Integrated electronic assembly for conserving space in a circuit
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Application No.: US15238151Application Date: 2016-08-16
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Publication No.: US10098231B2Publication Date: 2018-10-09
- Inventor: Stephen Michael Sedio
- Applicant: Coilcraft, Incorporated
- Applicant Address: US IL Cary
- Assignee: Coilcraft, Incorporated
- Current Assignee: Coilcraft, Incorporated
- Current Assignee Address: US IL Cary
- Agency: Fitch, Even, Tabin & Flannery LLP
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L21/00 ; H05K1/11 ; H05K5/00 ; H05K7/00 ; H05K7/20 ; H01F5/04 ; H05K3/34

Abstract:
An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.
Public/Granted literature
- US20160360633A1 INTEGRATED ELECTRONIC ASSEMBLY FOR CONSERVING SPACE IN A CIRCUIT Public/Granted day:2016-12-08
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