Invention Grant
- Patent Title: Flexible electronic module and manufacturing method thereof
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Application No.: US14983594Application Date: 2015-12-30
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Publication No.: US10098225B2Publication Date: 2018-10-09
- Inventor: Chih-Chia Chang , Ming-Huan Yang , Cheng-Chung Lee , Jia-Chong Ho , Chen-Chu Tsai , Kun-Lin Chuang
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW104137430A 20151113
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K3/00 ; H03K17/96 ; H05K3/28

Abstract:
A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.
Public/Granted literature
- US20160295689A1 FLEXIBLE ELECTRONIC MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2016-10-06
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