An assembly and a method for maximizing the current-carrying capacity of conductor tracks and the current-carrying capacity of conductors on or within a circuit board, allows for the use of copper materials, and minimizes the costs of materials and production of the circuit board. The circuit board is connected via a housing with a coolant of a cryogenic device in order to provide heat extraction. The extraction of heat from the circuit board occurs by connecting the circuit board via a housing with a coolant of a cryogenic device.