Invention Grant
- Patent Title: Package for device to be packaged, manufacturing method thereof, and OLED apparatus comprising the package
-
Application No.: US15098495Application Date: 2016-04-14
-
Publication No.: US10096793B2Publication Date: 2018-10-09
- Inventor: Yujing Cao , Song Song
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD,BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD
- Current Assignee Address: CN Beijing CN Beijing
- Agency: Armstrong Teasdale LLP
- Priority: CN201510424960 20150717
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00 ; H01L51/52
Abstract:
A package is provided. The package includes a base substrate includes a first surface, a second surface opposite the first surface, and a side face, wherein a device to be packaged is formed on the first surface, and a packaging cover-plate surrounding the first surface of the base substrate and directly coupled to at least one of the side face and the second surface of the base substrate, wherein the device to be packaged is formed in an enclosure space defined by the packaging cover-plate and the base substrate.
Public/Granted literature
- US20170018731A1 PACKAGE, MANUFACTURING METHOD THEREOF AND OLED APPARATUS Public/Granted day:2017-01-19
Information query
IPC分类:
