Invention Grant
- Patent Title: Light emitting device
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Application No.: US14452827Application Date: 2014-08-06
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Publication No.: US10096753B2Publication Date: 2018-10-09
- Inventor: Tsuyoshi Okahisa , Yuta Oka , Daisuke Sanga
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi, Tokushima
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi, Tokushima
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2013-164212 20130807
- Main IPC: H01L33/54
- IPC: H01L33/54

Abstract:
A light emitting device has a lens, extended to outside of the mounting substrate on which a semiconductor a light emitting element is mounted, and leakage of light is reduced. A light emitting element, a substrate having the light emitting element mounted on its upper surface, and a lens, having a curved upper surface encloses the light emitting element and the upper surface of the substrate is included. From the bottom surface of the lens, a lower surface of the substrate is exposed. In a top view from a perpendicular direction to the upper surface of the substrate, the bottom surface of the lens includes an outer extending portion where the bottom surface is extended to outside of the substrate, and a inclined portion, which inclines with respect to a direction approximately in parallel to the upper surface of the substrate, at an end portion of the outer extending portion.
Public/Granted literature
- US20150041844A1 LIGHT EMITTING DEVICE Public/Granted day:2015-02-12
Information query
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