Invention Grant
- Patent Title: Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
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Application No.: US15468941Application Date: 2017-03-24
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Publication No.: US10096680B2Publication Date: 2018-10-09
- Inventor: Naoki Kumagai , Takashi Tsutsumi , Yoshiyuki Sakai , Yasuhiko Oonishi , Takumi Fujimoto , Kenji Fukuda , Shinsuke Harada , Mitsuo Okamoto
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2015-006394 20150116; JP2015-006395 20150116
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/10 ; H01L29/45 ; H01L29/47

Abstract:
A silicon carbide semiconductor device, including a silicon carbide semiconductor structure, an insulated gate structure including a gate insulating film contacting the silicon carbide semiconductor structure and a gate electrode formed on the gate insulating film, an interlayer insulating film covering the insulated gate structure, a metal layer provided on the interlayer insulating film for absorbing or blocking hydrogen, and a main electrode provided on the metal layer and electrically connected to the silicon carbide semiconductor structure.
Public/Granted literature
- US20170194438A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2017-07-06
Information query
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