- Patent Title: Solid-state imaging apparatus and method for manufacturing the same
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Application No.: US14728339Application Date: 2015-06-02
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Publication No.: US10096640B2Publication Date: 2018-10-09
- Inventor: Tomoyuki Arai , Fumiaki Sano
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-179545 20110819
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
Certain embodiments provide a solid-state imaging apparatus including a first impurity layer, a second impurity layer, a third impurity layer, and an electrode. The first impurity layer is a photoelectric conversion layer, and is formed to have a constant depth on a semiconductor substrate. The second impurity layer is formed on a surface of the first impurity layer, to have a depth which becomes shallower toward a direction from the first impurity layer to the third impurity layer. The third impurity layer is formed in a position spaced apart from the first impurity layer and the second impurity layer on the surface of the semiconductor substrate. The electrode can transport electric charges from the first impurity layer to the third impurity layer, and is formed between the second impurity layer and the third impurity layer, on the surface of the semiconductor substrate.
Public/Granted literature
- US20150325607A1 SOLID-STATE IMAGING APPARATUS AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2015-11-12
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