Invention Grant
- Patent Title: Method of making a FinFET device
-
Application No.: US15257469Application Date: 2016-09-06
-
Publication No.: US10096519B2Publication Date: 2018-10-09
- Inventor: Ming-Feng Shieh , Wen-Hung Tseng , Tzung-Hua Lin , Hung-Chang Hsieh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L27/088 ; H01L21/02 ; H01L21/8234 ; H01L21/308 ; H01L21/311 ; H01L21/762

Abstract:
A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.
Public/Granted literature
- US20160379889A1 Method Of Making A Finfet Device Public/Granted day:2016-12-29
Information query
IPC分类: