Invention Grant
- Patent Title: Carrier and a method for processing a carrier
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Application No.: US15421472Application Date: 2017-02-01
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Publication No.: US10096511B2Publication Date: 2018-10-09
- Inventor: Steffen Bieselt
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Viering, Jentschura & Partner mbB
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H01L21/764

Abstract:
According to various embodiments, a carrier may be provided, the carrier including: a hollow chamber spaced apart from a surface of the carrier; a trench structure extending from the surface of the carrier to the hollow chamber and laterally surrounding a first region of the carrier, the trench structure including one or more trenches extending from the surface of the carrier to the hollow chamber, and one or more support structures intersecting the one or more trenches and connecting the first region of the carrier with a second region of the carrier outside the trench structure, wherein the one or more support structures including an electrically insulating material.
Public/Granted literature
- US20170140978A1 CARRIER AND A METHOD FOR PROCESSING A CARRIER Public/Granted day:2017-05-18
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