Invention Grant
- Patent Title: Liquid cooling server
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Application No.: US15484810Application Date: 2017-04-11
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Publication No.: US10091913B2Publication Date: 2018-10-02
- Inventor: Akira Shimasaki
- Applicant: FUJITSU LIMITED
- Applicant Address: JP Kawasaki
- Assignee: FUJITSU LIMITED
- Current Assignee: FUJITSU LIMITED
- Current Assignee Address: JP Kawasaki
- Agency: Fujitsu Patent Center
- Priority: JP2016-083898 20160419
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20

Abstract:
A liquid cooling server includes a chassis including a unit case housing portion; a unit case which moves in a first direction for being inserted in and pulled out from the unit case housing portion and includes a heat generating component and a portion to be cooled; a cooling plate which is disposed to the chassis, opposes the unit case housing portion in a second direction perpendicular to the first direction, and includes a flow path through which a cooling medium flows; a metal portion which is provided to either one of the cooling plate and the portion to be cooled, includes a plurality of first protrusions which protrude in the second direction towards the unit case housing portion and are arranged in the first direction; and a heat transfer body provided between the metal portion and the first member in the second direction, the heat transfer body being elasticity.
Public/Granted literature
- US20170303440A1 LIQUID COOLING SERVER Public/Granted day:2017-10-19
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