Invention Grant
- Patent Title: Laser direct imaging system and method for solder mask exposure
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Application No.: US15230864Application Date: 2016-08-08
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Publication No.: US10091892B2Publication Date: 2018-10-02
- Inventor: Chun-Chih Chuang , Yung-Peng Hu
- Applicant: SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD.
- Applicant Address: TW Taichung
- Assignee: SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD.
- Current Assignee: SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD.
- Current Assignee Address: TW Taichung
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW104129236A 20150903
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/54 ; H05K3/34 ; G03F7/20 ; H05K3/00

Abstract:
A laser direct imaging system includes a stage, a laser device and an oxygen-reducing device. The stage is subjected to an atmospheric pressure. The laser device is configured to provide a laser beam to scan across the substrate. The oxygen-reducing device operates simultaneously with the laser device for outputting an inert gas only to a specific area where the laser beam is being aimed such that any portion of the substrate, if enters the specific area, will be exposed to the laser beam under a low-oxygen environment.
Public/Granted literature
- US20170068167A1 LASER DIRECT IMAGING SYSTEM AND METHOD FOR SOLDER MASK EXPOSURE Public/Granted day:2017-03-09
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