Invention Grant
- Patent Title: Acoustic wave device
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Application No.: US15454928Application Date: 2017-03-09
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Publication No.: US10090825B2Publication Date: 2018-10-02
- Inventor: Takuma Kuroyanagi
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2016-097206 20160513
- Main IPC: H03H9/54
- IPC: H03H9/54 ; H03H9/64 ; H01L23/522 ; H01L23/528 ; H01L23/532 ; H03H9/145

Abstract:
An acoustic wave device includes: a first substrate; a first acoustic wave filter located on a first surface of the first substrate; a pad that is located on the first surface and electrically separated from the first acoustic wave filter in the first surface; a ground pattern that is located on the first surface, and is located between the pad and the first acoustic wave filter in the first surface; and a second acoustic wave filter that is electrically connected to the pad, and at least partially overlaps with the first acoustic wave filter in plan view.
Public/Granted literature
- US20170331455A1 ACOUSTIC WAVE DEVICE Public/Granted day:2017-11-16
Information query
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