A dielectric housing with a forward mating portion, a flange and a rear portion. The forward mating portion is receivable in a cutout in a mounting panel. The flange extends from the housing and is dimensioned larger than the cutout. The rear portion has a rear face with terminal-receiving cavities extending inwardly through the rear face. A top surface of the forward mating portion extends from the flange at an obtuse angle, the top surface is essentially perpendicular to a forward mating face of the forward mating portion of the housing. The terminal-receiving cavities extend from the rear face to the forward mating face, with the longitudinal axis of the terminal-receiving receiving cavities extending in a straight line. The forward mating face of the housing is angled relative to the flange and the mounting panel to prevent condensation from occurring on the forward mating face.