Invention Grant
- Patent Title: Method of manufacturing a waveguide assembly by adhesively bonding two waveguide units and a waveguide structure formed therefrom
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Application No.: US15429487Application Date: 2017-02-10
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Publication No.: US10090575B2Publication Date: 2018-10-02
- Inventor: Pai-Lee Chang , Guan-Yu Chen
- Applicant: TennVac Inc. , TennMAX America Inc.
- Applicant Address: TW New Taipei US WA Vancouver
- Assignee: Tenn Vac Inc.,TennMax America Inc.
- Current Assignee: Tenn Vac Inc.,TennMax America Inc.
- Current Assignee Address: TW New Taipei US WA Vancouver
- Agency: Marquez IP Law Office, PLLC
- Agent Juan Carlos A. Marquez
- Main IPC: H01P3/12
- IPC: H01P3/12 ; C09J5/04 ; C09J123/06 ; H01P11/00 ; H01P1/04

Abstract:
The present invention provides a method of manufacturing a waveguide assembly and a structure thereof, wherein the manufacturing method comprises the steps of: providing at least two waveguide units and combining the waveguide units, wherein each waveguide unit has at least one bonding portion formed at a position where each two said waveguide units are combined; and at least one adhesive is applied to the bonding portion to combine the waveguide units into the waveguide assembly. With the practice of the present invention, many advanced functions such as rapid design, rapid manufacture, rapid verification and cost reduction can be achieved.
Public/Granted literature
- US20180151935A1 METHOD OF MANUFACTURING WAVEGUIDE ASSEMBLY AND STRUCTURE THEREOF Public/Granted day:2018-05-31
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