Invention Grant
- Patent Title: Integrated on chip detector and zero waveguide module structure for use in DNA sequencing
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Application No.: US15605685Application Date: 2017-05-25
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Publication No.: US10090429B2Publication Date: 2018-10-02
- Inventor: Effendi Leobandung
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/105 ; H01L31/0352 ; C12Q1/68 ; C12Q1/6874

Abstract:
A semiconductor structure for use in single molecule real time DNA sequencing technology is provided. The structure includes a semiconductor substrate including a first region and an adjoining second region. A photodetector is present in the first region and a plurality of semiconductor devices is present in the second region. A contact wire is located on a surface of a dielectric material that surrounds the photodetector and contacts a topmost surface of the photodetector and a portion of one of the semiconductor devices. An interconnect structure is located above the first region and the second region, and a metal layer is located atop the interconnect structure. The metal layer has a zero waveguide module located above the first region of the semiconductor substrate. A DNA polymerase can be present at the bottom of the zero waveguide module.
Public/Granted literature
- US20170263801A1 INTEGRATED ON CHIP DETECTOR AND ZERO WAVEGUIDE MODULE STRUCTURE FOR USE IN DNA SEQUENCING Public/Granted day:2017-09-14
Information query
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