Invention Grant
- Patent Title: Silicon carbide semiconductor device and fabrication method of silicon carbide semiconductor device
-
Application No.: US14404827Application Date: 2013-03-18
-
Publication No.: US10090417B2Publication Date: 2018-10-02
- Inventor: Takashi Tsuji , Akimasa Kinoshita , Noriyuki Iwamuro , Kenji Fukuda
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-shi
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-125254 20120531
- International Application: PCT/JP2013/057747 WO 20130318
- International Announcement: WO2013/179728 WO 20131205
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L21/44 ; H01L29/47 ; H01L29/66 ; H01L21/322 ; H01L21/425 ; H01L21/28 ; H01L29/872 ; H01L29/06 ; H01L29/08 ; H01L29/16 ; H01L21/02 ; H01L29/36

Abstract:
A p-type region, a p− type region, and a p+ type region are selectively disposed in a surface layer of a silicon carbide substrate base. The p-type region and the p− type region are disposed in a breakdown voltage structure portion that surrounds an active region. The p+ type region is disposed in the active region to make up a JBS structure. The p− type region surrounds the p-type region to make up a junction termination structure. A Schottky electrode forms a Schottky junction with an n-type silicon carbide epitaxial layer. The Schottky electrode overhangs an interlayer insulation film covering a portion of the p-type region and this overhanging portion acts as a field plate. The p+ type region has an acceptor concentration greater than or equal to a predetermined concentration and can make a forward surge current larger.
Public/Granted literature
- US20150144965A1 SILICON CARBIDE SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2015-05-28
Information query
IPC分类: