Invention Grant
- Patent Title: TFT substrate manufacture method
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Application No.: US15513562Application Date: 2017-02-13
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Publication No.: US10090414B2Publication Date: 2018-10-02
- Inventor: Macai Lu , Jiangbo Yao , Shijian Qin
- Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Soroker Agmon Nordman
- Priority: CN201710002056 20170103
- International Application: PCT/CN2017/073330 WO 20170213
- Main IPC: H01L21/84
- IPC: H01L21/84 ; H01L29/786 ; H01L29/51 ; H01L21/02 ; H01L29/423

Abstract:
The present invention provides a TFT (Thin Film Transistor) substrate manufacture method, which includes forming a TFT gate electrode on a substrate, sequentially forming a first insulation layer, an active layer, a source electrode, and a drain electrode, and then forming a second insulation layer and coating a photoresist thereon, defining a pixel electrode pattern, forming a drain VIA hole on the second insulation layer, depositing a pixel electrode layer after preparing suede on the photoresist, and permeating the suede with a stripping liquid to remove the photoresist and the pixel electrode layer on the photoresist so as to form a pixel electrode connecting to the drain electrode via the drain VIA hole.
Public/Granted literature
- US20180233598A1 TFT SUBSTRATE MANUFACTURE METHOD Public/Granted day:2018-08-16
Information query
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