Invention Grant
- Patent Title: Array substrate and manufacturing method thereof, and display apparatus
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Application No.: US14785830Application Date: 2015-02-27
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Publication No.: US10090368B2Publication Date: 2018-10-02
- Inventor: Jingang Fang , Longbao Xin , Hongda Sun
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Kinney & Lange, P.A.
- Priority: CN201410678072 20141121
- International Application: PCT/CN2015/073340 WO 20150227
- International Announcement: WO2016/078248 WO 20160526
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L27/32

Abstract:
The present invention provides an array substrate and a manufacturing method thereof, and a display apparatus; and it relates to the field of display. The array substrate includes a first thin film transistor and a first electrode which are formed on a substrate. The first thin film transistor includes a gate, a gate insulating layer, an active layer, and an etch stop layer. The etch stop layer is formed with first via holes, and the etch stop layer and the gate insulating layer are formed with a second via hole at a position corresponding to the first electrode. A maximal diameter of the first via holes is not greater than a minimal diameter of the second via hole.
Public/Granted literature
- US20160358991A1 ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY APPARATUS Public/Granted day:2016-12-08
Information query
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