Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
-
Application No.: US15258220Application Date: 2016-09-07
-
Publication No.: US10090319B2Publication Date: 2018-10-02
- Inventor: Jun Fujiki , Shinya Arai
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L27/11534
- IPC: H01L27/11534 ; H01L27/11568 ; H01L27/11582 ; H01L21/48 ; H01L23/498 ; H01L27/11565 ; H01L27/1157 ; H01L27/11575

Abstract:
According to one embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type; a stacked body; a plurality of columnar portions; a plurality of first insulating portions having a wall configuration; and a plurality of second insulating portions having a columnar configuration. The columnar portions extend in a stacking direction of the stacked body. The columnar portions include a semiconductor body and a charge storage film. The first insulating portions extend in the stacking direction and in a first direction crossing the stacking direction. The second insulating portions extend in the stacking direction. A wide of the second insulating portions along a second direction crossing the first direction in a plane is wider than a wide of the first insulating portions along the second direction. The second insulating portions are disposed in a staggered lattice configuration.
Public/Granted literature
- US20170263631A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-09-14
Information query
IPC分类: