Invention Grant
- Patent Title: Metal pad modification
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Application No.: US15636038Application Date: 2017-06-28
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Publication No.: US10090271B1Publication Date: 2018-10-02
- Inventor: Krishna Tunga , Ekta Misra
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Jared C. Chaney
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L23/528

Abstract:
The present invention provides a structure. In an exemplary embodiment, the structure includes a base material, at least one metal pad, where a first surface of the metal pad is in contact with the base material, and a metal pedestal, where the metal pedestal is in contact with the metal pad, where a radial alignment of the metal pad is shifted by an offset distance, with respect to the metal pedestal, such that the metal pad is shifted towards a center axis of the base material, where a first dimension of the metal pad is smaller than a second dimension of the metal pad, where the second dimension is orthogonal to a line running from a center of the metal pad to the center axis of the base material, where the first dimension is parallel to the line.
Information query
IPC分类: