Invention Grant
- Patent Title: Semiconductor device and semiconductor package
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Application No.: US14183803Application Date: 2014-02-19
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Publication No.: US10090235B2Publication Date: 2018-10-02
- Inventor: Isao Ozawa , Isao Maeda , Yasuo Kudo , Koichi Nagai , Katsuya Murakami
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/13 ; H01L23/498 ; H01L23/50 ; H01L25/065 ; H01L23/31 ; H01L23/66 ; H01L23/00 ; H01L25/18
Abstract:
According to one embodiment, a semiconductor device includes a board, a sealing portion, a controller, a semiconductor chip, and solder balls. The board includes a first surface and a second surface opposite to the first surface. The controller and the semiconductor chip are covered with the sealing portion. The solder balls are on the second surface of the board. The solder balls include a plurality of solder ball sets each corresponding to a pair of differential input and differential output signals, and the plurality of solder ball sets are arranged substantially parallel to a side of the board.
Public/Granted literature
- US20150130059A1 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE Public/Granted day:2015-05-14
Information query
IPC分类:
