Invention Grant
- Patent Title: Conductive connections, structures with such connections, and methods of manufacture
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Application No.: US15715515Application Date: 2017-09-26
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Publication No.: US10090231B2Publication Date: 2018-10-02
- Inventor: Cyprian Emeka Uzoh , Rajesh Katkar
- Applicant: INVENSAS CORPORATION
- Applicant Address: US CA San Jose
- Assignee: INVENSAS CORPORATION
- Current Assignee: INVENSAS CORPORATION
- Current Assignee Address: US CA San Jose
- Agency: Haynes and Boone, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/498 ; B32B15/01 ; B23K35/22 ; H01L25/00 ; H01L25/10 ; H01L21/56 ; H01L21/48 ; H01L23/31 ; B23K35/02 ; B23K1/00 ; H01L25/065 ; B23K101/40
Abstract:
A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.
Public/Granted literature
- US20180019191A1 CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHODS OF MANUFACTURE Public/Granted day:2018-01-18
Information query
IPC分类:
