Invention Grant
- Patent Title: Sheet having adhesive resin layer attached thereto, and method for producing semiconductor device
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Application No.: US14400340Application Date: 2013-05-14
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Publication No.: US10086594B2Publication Date: 2018-10-02
- Inventor: Katsuhiko Horigome , Akinori Sato , Yusuke Nezu
- Applicant: LINTEC Corporation
- Applicant Address: JP Tokyo
- Assignee: LINTEC Corporation
- Current Assignee: LINTEC Corporation
- Current Assignee Address: JP Tokyo
- Agency: Cahn & Samuels, LLP
- Priority: JP2012-110644 20120514
- International Application: PCT/JP2013/063379 WO 20130514
- International Announcement: WO2013/172328 WO 20131121
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B27/08 ; B32B27/32 ; B32B37/18 ; B32B38/10 ; C09J133/08 ; H01L21/683 ; H01L23/00 ; B32B27/30 ; C09J7/38
Abstract:
A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is −0.5 to 0.5% and the bending resistance of the base is 80 mm or more.
Public/Granted literature
- US20150165743A1 Sheet Having Adhesive Resin Layer Attached Thereto, and Method for Producing Semiconductor Device Public/Granted day:2015-06-18
Information query
