Invention Grant
- Patent Title: Ultrasonic probe
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Application No.: US14808326Application Date: 2015-07-24
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Publication No.: US10085717B2Publication Date: 2018-10-02
- Inventor: Kyungil Cho , Jong Keun Song
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0102545 20140808
- Main IPC: A61B8/00
- IPC: A61B8/00

Abstract:
An ultrasonic probe includes: a housing having an opening provided at a first end portion of the housing; a transducer provided in a position corresponding to the opening and configured to generate ultrasonic waves; a heat spreader provided underneath the transducer; and a printed circuit board (PCB) disposed between the transducer and the heat spreader, wherein the heat spreader includes: a body portion configured to absorb heat from the transducer; and a coupling portion that is formed at a side portion of the body portion and coupled to the housing.
Public/Granted literature
- US20160041129A1 ULTRASONIC PROBE Public/Granted day:2016-02-11
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