A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.