- Patent Title: Multi-strike process for bonding packages and the packages thereof
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Application No.: US15433421Application Date: 2017-02-15
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Publication No.: US10068868B2Publication Date: 2018-09-04
- Inventor: Tung-Liang Shao , Chih-Hang Tung , Wen-Lin Shih , Hsiao-Yun Chen , Chen-Hua Yu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/00 ; H01L21/56 ; H01L23/31 ; H01L25/065 ; B23K1/00 ; B23K1/06
Abstract:
A method includes performing a first strike process to strike a metal bump of a first package component against a metal pad of a second package component. A first one of the metal bump and the metal pad includes copper. A second one of the metal bump and the metal pad includes aluminum. The method further includes performing a second strike process to strike the metal bump against the metal pad. An annealing is performed to bond the metal bump on the metal pad.
Public/Granted literature
- US20170194278A1 Multi-Strike Process for Bonding Public/Granted day:2017-07-06
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