Invention Grant
- Patent Title: Imaging apparatus and electronic appliance for realizing a miniaturized module
-
Application No.: US14903110Application Date: 2014-08-08
-
Publication No.: US10044917B2Publication Date: 2018-08-07
- Inventor: Hidetsugu Otani , Yuuji Kishigami
- Applicant: SONY CORPORATION
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Chip Law Group
- Priority: JP2013-172536 20130822
- International Application: PCT/JP2014/071035 WO 20140808
- International Announcement: WO2015/025742 WO 20150226
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G03B17/02 ; G02B7/08 ; G03B11/00 ; G02B5/20 ; G02B13/00

Abstract:
The present technology relates to an imaging apparatus, a manufacturing apparatus, a manufacturing method, and an electronic appliance that contribute to miniaturization and thinning of an imaging apparatus. Provided is an imaging apparatus including a first circuit board in which an imaging element is mounted on a center portion, a component that is mounted on an outer circumference portion of the center portion of the first circuit board, and a member that incorporates the component and is provided in the outer circumference portion and is formed by a mold method. The imaging apparatus further includes a lens barrel that holds a lens, in which a frame that supports a portion including the lens barrel is located on the member. Further, the frame includes an infra red cut filter (IRCF). The present technology can be applied to an imaging apparatus.
Public/Granted literature
- US20160191767A1 IMAGING APPARATUS, MANUFACTURING APPARATUS, MANUFACTURING METHOD AND ELECTRONIC APPLIANCE Public/Granted day:2016-06-30
Information query