Invention Grant
- Patent Title: Solder-creep management in high-power laser devices
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Application No.: US15006693Application Date: 2016-01-26
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Publication No.: US10044171B2Publication Date: 2018-08-07
- Inventor: Parviz Tayebati , Bien Chann , Robin Huang , Michael Deutsch
- Applicant: Parviz Tayebati , Bien Chann , Robin Huang , Michael Deutsch
- Applicant Address: US MA Wilmington
- Assignee: TERADIODE, INC.
- Current Assignee: TERADIODE, INC.
- Current Assignee Address: US MA Wilmington
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H01S5/40
- IPC: H01S5/40 ; H01S5/022 ; H01S5/14 ; H01S5/024
Abstract:
In various embodiments, laser apparatuses include thermal bonding layers between various components and creep-mitigation systems for preventing or retarding movement of thermal bonding material out of the thermal bonding layers.
Public/Granted literature
- US20160218482A1 SOLDER-CREEP MANAGEMENT IN HIGH-POWER LASER DEVICES Public/Granted day:2016-07-28
Information query
