Invention Grant
- Patent Title: Contact terminal and IC socket including the same
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Application No.: US15432072Application Date: 2017-02-14
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Publication No.: US10044124B2Publication Date: 2018-08-07
- Inventor: Hideki Sagano , Hideki Sato
- Applicant: YAMAICHI ELECTRONICS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: YAMAICHI ELECTRONICS CO., LTD.
- Current Assignee: YAMAICHI ELECTRONICS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2016-034757 20160225
- Main IPC: H01R13/193
- IPC: H01R13/193 ; H01R12/89 ; G01R1/04 ; H01L23/32 ; H01L23/00 ; H01R13/24 ; H05K7/10
Abstract:
In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.
Public/Granted literature
- US20170250484A1 CONTACT TERMINAL AND IC SOCKET INCLUDING THE SAME Public/Granted day:2017-08-31
Information query
