Invention Grant
- Patent Title: Method for manufacturing light emitting device
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Application No.: US15717242Application Date: 2017-09-27
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Publication No.: US10043956B2Publication Date: 2018-08-07
- Inventor: Hiroki Yuu
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2016-191246 20160929; JP2017-184703 20170926
- Main IPC: H01L33/24
- IPC: H01L33/24 ; H01L33/52 ; H01L33/00 ; H01L33/44 ; H01L21/82 ; H01L33/62

Abstract:
A method for manufacturing a light emitting device includes: preparing an intermediate body including a plurality of light emitting elements spaced apart from each other, each of the light emitting elements having a pair of electrodes disposed on the same side, and a covering member covering side surfaces of the light emitting elements while a part of a surface of each of the electrodes is exposed from the covering member, the covering member having a recess between adjacent ones of the light emitting elements; forming a metal layer that continuously covers the surface of each of the electrodes of the light emitting elements and an inner surface of the recess of the covering member; and cutting the metal layer and the covering member at the inner surface of the recess.
Public/Granted literature
- US20180090648A1 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-03-29
Information query
IPC分类: