Invention Grant
- Patent Title: Semiconductor devices having high-quality epitaxial layer and methods of manufacturing the same
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Application No.: US15368629Application Date: 2016-12-04
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Publication No.: US10043909B2Publication Date: 2018-08-07
- Inventor: Huilong Zhu
- Applicant: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Applicant Address: CN Beijing
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN Beijing
- Agency: Christensen, Fonder, Dardi & Herbert PLLC
- Priority: CN201510888884 20151207
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/762 ; H01L29/06 ; H01L29/165 ; H01L29/20 ; H01L29/66 ; H01L21/311

Abstract:
A semiconductor device with a high-quality epitaxial layer and a method of manufacturing the same. The semiconductor device may include: a substrate; a fin-shaped first semiconductor layer spaced apart from the substrate; a second semiconductor layer at least partially surrounding a periphery of the first semiconductor layer; an isolation layer formed on the substrate, exposing at least a part of the second semiconductor layer, wherein the exposed part of the second semiconductor layer extends in a fin shape; and a gate stack formed on the isolation layer and intersecting the second semiconductor layer.
Public/Granted literature
- US20170162697A1 SEMICONDUCTOR DEVICES HAVING HIGH-QUALITY EPITAXIAL LAYER AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2017-06-08
Information query
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