Invention Grant
- Patent Title: Uniform vertical field effect transistor spacers
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Application No.: US15817325Application Date: 2017-11-20
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Publication No.: US10043874B2Publication Date: 2018-08-07
- Inventor: Kangguo Cheng , Juntao Li
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L29/417 ; H01L29/66 ; H01L29/06 ; H01L29/78

Abstract:
Aspects of the disclosure include a semiconductor structure that includes a vertical fin structure having a top portion, a bottom portion, vertical side walls, a source area in contact with the vertical fin structure, a drain area in contact with the vertical fin structure, a plurality of spacers comprising a first oxide layer in contact with the source area, and a second oxide layer in contact with the drain area. The first oxide layer can have a thickness that is equal to a thickness of the second oxide layer.
Public/Granted literature
- US20180090579A1 UNIFORM VERTICAL FIELD EFFECT TRANSISTOR SPACERS Public/Granted day:2018-03-29
Information query
IPC分类: