Invention Grant
- Patent Title: Semiconductor package devices integrated with inductor
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Application No.: US15088128Application Date: 2016-04-01
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Publication No.: US10043745B2Publication Date: 2018-08-07
- Inventor: Wei-Ting Chen , In-Tsang Lin , Vincent Chen , Chuei-Tang Wang , Chen-Hua Yu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/528 ; H01L23/532 ; H01L49/02 ; H01L23/498 ; H01L23/14 ; H01L23/15
Abstract:
The present disclosure provides an inductor structure. The inductor structure, comprising a first surface, a second surface intersecting with the first surface, a first conductive pattern and a second conductive pattern. The first conductive pattern is formed on the first surface. The second conductive pattern is formed on the second surface. The first conductive pattern is connected with the second conductive pattern.
Public/Granted literature
- US20170287832A1 SEMICONDUCTOR PACKAGE DEVICES INTEGRATED WITH INDUCTOR Public/Granted day:2017-10-05
Information query
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