Invention Grant
- Patent Title: Method and system for removing heat from multiple controllers on a circuit board
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Application No.: US15428000Application Date: 2017-02-08
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Publication No.: US10042400B2Publication Date: 2018-08-07
- Inventor: Kevin M Takeuchi
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Chang & Hale LLP
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K5/00 ; G06F1/20 ; H05K1/02 ; H05K7/20
Abstract:
A heat sink including a top surface, a first bottom surface configured to thermally contact a first controller having a first height from a circuit board, and a second bottom surface configured to thermally contact a second controller having a second height from the circuit board, wherein the second height is different than the first height.
Public/Granted literature
- US20170147045A1 METHOD AND SYSTEM FOR REMOVING HEAT FROM MULTIPLE CONTROLLERS ON A CIRCUIT BOARD Public/Granted day:2017-05-25
Information query
